Page 56 - GETELEC catalogue US 2020
P. 56
Seals secured by overmolding
The procedure used in our production facility, enables seals to be vulcanized by molding onto the covers of
electronic assemblies, in the various conductive materials, bringing the following advantages :
• No need to glue seals
• Improved mechanical perfomance
• Elimination of cumulative tolerances in the cover | adhesive | seal assembly
• Eliminates the need to machine grooves for positioning flat or rounded seals
• Optimized seal cost
• Enables provision of externally fitted sealing component, enabling corrosion-resistant assemblies
• Choice of materials
• Reduced delays
The assembly’s electrical and mechanical characteristics are similar to those quoted on the specification sheets
of the material used.
1 / Customer’s 3 / Seal secured by
component overmolding
2 / Compression molding direct on the component
We are also able to provide a complete solution with
mechanical part and gasket .
375 avenue Morane Saulnier 78530 - Buc, France www.getelec.com
55 Tel : +33 1 39 20 42 42 | info@getelec.com
