Page 152 - GETELEC catalogue US 2020

GT 12097 epoxy silver conductive glues

Use : GT 12097 is two-component silver-loaded epoxy, specially designed as a chip adhesive for when low temperature
polymerisation is required. GT12097 is also recommended for applications needing high temperature polymerisation
: at 105°C, GT12097 polymerises in 5 minutes, unlike the 30 minutes needed by many single component products .
This low viscosity resin contains no solvents

Life span : Before mixing, the resin has a life span of 2 years in ambiant conditions; mixed product remains usable
foR 4 days also at ambiant. Due to its long mixed lifespan and the absence of solvents, GT12097 is ideal for us on
automated production lines. The combination of a long lifespan when mixed and rapid polymerisation mean that
GT 12097 is an ideal production optimistion tool.

Temperature : Experience demonstrates that, polymerised above 120°C, GT12097 withstands soldering
temperatures of 300°C to 400°C.

POLYMERISATION VOLUME RESISTIVITY SHEARING RESISTANCE
Temp. °C Minutes Ω cm Bar
80 90 0.0009 56
100 40 0.0005 70
120 15 0.0002 77
150 5 0.00008 91
180 1 0.00005 91

Coefficient of expansion : Before Tg = 3.2 x 10-5 – after Tg = 5.4 x 10-5.

Density : 2.60.

Important: Before mixing, ensure that both A and B are well stirred. Part A : 2/5 by weight - Part B : 3/5
by weight

Presentation
28 gram jar

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